XSYS Backs The Hybrid Fusion Packaging Summit With New Support Initiatives

Julie Fernandez by Julie Fernandez
April 14, 2025
in Packaging & Printing
XSYS Backs The Hybrid Fusion Packaging Summit With New Support Initiatives

XSYS Backs The Hybrid Fusion Packaging Summit With New Support Initiatives

A leading provider of cutting-edge printing plates, plate processing equipment, and screening software for the flexographic industry, has announced its participation at the Hybrid Fusion Packaging Summit 2025. Held in Amsterdam, the Netherlands, on April 22–25, the event will bring together printing and prepress specialists, along with industry experts, OEM partners, and brand representatives, to explore the latest trends in labels and packaging.

As a silver sponsor, XSYS is joining the Hybrid Software event to share its deep expertise in sustainable, future-focused flexo innovation. The team will be available to discuss the latest automation and connectivity advancements in platemaking using ThermoFlexX and Catena imaging and processing solutions, designed to integrate with existing workflows and MIS/ERP systems. Attendees can also learn about the Catena+ fully automated, end-to-end platemaking line; an innovative touch-free system created for Industry 4.0 manufacturing. Catena+ features ProServX cloud-based, real-time monitoring for proactive maintenance and superior quality control. Supplying detailed plate processing data and individual reports for each job, this new software tool allows decision-makers to optimize OEE in the plate room and maintain high quality standards, while lowering waste and energy consumption.

“The upcoming Hybrid Fusion Packaging Summit in Amsterdam is a fantastic opportunity for XSYS to showcase how our brilliant innovations in prepress are driving flexo forward towards a more digitalized and sustainable future. The summit brings together experts from right across the value chain to share insights and experience as we move towards fully implementing Industry 4.0 principles. It certainly promises to be one of the key events in this year’s packaging industry calendar and we look forward to taking an active role in the conference,” said Bert Eeckhout, Product Manager Prepress Equipment & Software at XSYS.

The large event program, which features 30 interactive sessions, will include 20 speakers debating current trends and challenges in packaging printing. Giving a keynote address, industry analyst Marco Boer will offer an overview of the current state of business in labels and packaging. Meanwhile, they will share its unique value proposition in an introductory TED-style talk and take part in an in-depth roundtable discussion about specific prepress considerations for corrugated and folding carton printing, alongside representatives from Arden Software, AV Flexologic, Koenig & Bauer, and Zünd. Attendees can also network with them in a more informal setting during the evening gala dinners.

https://xsysglobal.com/

#xsysglobal #Modernplasticsindia #Pasticsnews #ModernPlasticsIndiaMagazine
#PackagingSummit2025

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